Application: CPU, GPU and other applications between power semiconductor components and heat sinks
Thermal Conductivity: 8.5 W/mK
Density: 2.5 g/ cm3
Viscosity: 870 poise
Net Weight: 4 g
* Product descriptions and part numbers are subject to change, and may not reflect manufacturer product changes. Please check the manufacturer's website and use the item's manufacturer part number to find the most up to date product description.
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