Application: CPU, GPU and other applications between power semiconductor components and heat sinks
Thermal Conductivity: 8.5 W/mK
Density: 2.5 g/ cm3
Viscosity: 870 poise
Net Weight: 4 g
* Product descriptions and part numbers are subject to change, and may not reflect manufacturer product changes. Please check the manufacturer's website and use the item's manufacturer part number to find the most up to date product description.
Reviewed by TIMOTHY from BLAKESLEE, PA on 03/13/14
The Good:
runs extremly well and pretty much the same thing as artic silver 5 but without the metal.
The Squirrelly:
very carefully push out the thermal paste its a little happy to get out. but once out it dont move. just when pushing it out its quick.
Pro Tip:
only put a pea size amount of the thermal paste on. no need to spread. the heat from the cpu when turned on will spread it for u and when you push down on the heat sink.
