High-Density(contains over 88% thermally conductive filler by weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)
Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)
Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch
Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C
Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core
* Product descriptions and part numbers are subject to change, and may not reflect manufacturer product changes. Please check the manufacturer's website and use the item's manufacturer part number to find the most up to date product description.
Reviewed by Shelby Gomez from Lake Havasu City, AZ on 06/08/10
Great price per ounce, works just like it should!
Quality Feel Reviewed by John C. from Florence, MS on 01/08/08
My compound choice for life. Very easy to apply and the quality can be felt while spreading on the cpu. Also makes heatsink mounting easier by not being as slippery as paste. I have not benchmarked temps but I don't doubt what the other reviews say.
Still the best Reviewed by maxwell stevenson from lewiston, ME on 01/13/07
This stuff really has set the benchmark for thermal compound.
If you use the cheap plastic ceramic kind your temperatures will be about 3-8 degrees warmer.