Application: CPU, GPU and other applications between power semiconductor components and heat sinks.
High Thermal Conductivity
Low Thermal Resistance
Density: 3.69 g/ cm3
Viscosity: 2850 poise
Net Weight: 4 g
* Product descriptions and part numbers are subject to change, and may not reflect manufacturer product changes. Please check the manufacturer's website and use the item's manufacturer part number to find the most up to date product description.
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